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Engineer - Process Development (thin film) - Entry Level

Please apply directly to Seagate for this role!


About our group
Our team’s mission is to develop new processes for state of the art recording technology.  Specifically, the design and development of novel recording head process technology, utilizing many of the same techniques and methodologies employed in nanoscale semiconductor manufacturing.

About the role:
The role of this engineer will be to provide process support for the reader development team, maintain processes for our latest designs, and develop new best in class processes for future designs.  The primary focus for this position is development and support of chemical mechanical polishing (CMP) processes involved in fabrication of the read sensor.  In addition to read sensor development, there will be joint CMP development projects associated with fabrication of other structures in the thin film head.  Because the thin film head utilizes multiple magnetic elements for sensor activation and stabilization, it is also desired that the candidate have a background in magnetics and/or magnetic materials (whether through coursework or practical experience).  This engineer will have the opportunity to work with and learn from a team of experienced engineers with various engineering backgrounds.
Responsibilities will include developing new processes, maintaining existing processes, investigating root cause of process failure, designing and coordinating critical experiments, and providing in depth data analysis.  A special focus for this position will be optimizing CMP processes and mitigating interactions between CMP and critical sensor materials.  Teamwork across shifts and across departments will be critical. 

About you:

  • MS or PhD with 0- 2 years of experience in thin film processing are preferred, though no previous experience in recording technology is required.   
  • Preference will be given to those with Physics, Chemistry, Materials Science, and Electrical, Mechanical, or Chemical Engineering backgrounds with relevant work / intern experience, especially with a background in Thin Film and CMP Processing.
  • Familiarity and experience with dielectric and/or magnetic materials optimization and characterization is strongly desired. 
  • While we are looking for a talented engineer with a broad engineering background, a deeper understanding of chemical-mechanical polishing and mitigation of potential corrosion interactions is required.  
  • The ability to learn quickly and adapt to change is critical to this candidate’s success.
  • Communicating results and issues effectively across our team will be particularly important. 
  • A successful engineer must be able to work independently to generate results. 

** Visa sponsorship is not available for this position